Conductive paste and circuit substrate formed by use of the paste
US6156237A · kind A · utility
35Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2000 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Jan 19, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive paste including an organic binder having an acidic functional group; an inorganic powder containing glass and/or ceramic; a conductive metallic powder; and a mono-ol compound having a boiling point of about 178.degree. C. or higher. At least one of the inorganic powder and the conductive metallic powder contains a multivalent metal. The paste is useful in the formation of a fine and minute thick-film conductive pattern having strong adhesion to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.