Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same
US6156831A · kind A · utility
6Cited by
8References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1998 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Jul 1, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A modified cyanate ester group curable resin composition, and varnishes, prepregs, laminated boards adhered with metal foil, films, printed circuit boards, and multilayered circuit boards using the same, comprising: (A) a cyanate ester group compound PA1 (B) a monovalent phenolic group compound PA1 (C) a polyphenylene ether resin, PA1 (D) a flame retardant not reactive with the cyanate ester group compound, and PA1 (E) a metal group reaction catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.