Furnace for processing semiconductor wafers
US6157003A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 27, 1998 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Oct 27, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68771
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A furnace for processing semiconductor wafers including an insulating enclosure; a first heating apparatus disposed centrally with respect to the insulating enclosure; a frame operative to support a multiplicity of semiconductor wafers in a nearly vertical orientation in at least one right polyhedronal tier about and facing the first centrally disposed heating apparatus; a double-walled quartz enclosure for enclosing the wafers which is operative to enable the wafers to be processed in a predetermined controlled environment; and a second heating apparatus disposed between the quartz enclosure and the insulating enclosure arranged, together with the first heating apparatus, for substantially uniform heating of the wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.