Optical module and lead frame for optical module
US6157050A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 9, 1999 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Jul 9, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optical module, including a plurality of optical devices and a plurality of circuit devices, which is suitable for a smaller size and a higher density, and a lead frame for the optical module are provided. The optical module comprises optical devices, circuit devices 30, 32 electrically connected to the optical devices; a lead frame mounting these devices on the same main surface; and a first encapsulating resin body 66, transparent to light processed by the optical devices, for encapsulating the optical devices. The lead frame has a single first die pad for mounting a plurality of optical devices; a plurality of second die pads 4, 6 each for mounting a circuit device; connection lead groups 40, 42, whose number is the same as that of the second die pads, having a plurality of connection leads 44, 48 for electrically connecting the optical devices mounted on the first die pad to the circuit devices mounted on the second die pads 4, 6; and wiring leads 50, 51 arranged so as to face the respective side faces of the second die pads 4, 6. In the optical module, the optical devices are connected to the wiring leads 50, 51 by way of the connection leads 44, 48.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.