Patent · US Expired

Integrating dual supply voltage by removing the drain extender implant from the high voltage device

US6157062A · kind A · utility

12Cited by
6References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 6, 1999
Grant dateDec 5, 2000
Priority date
Expiry dateApr 6, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D84/038

Abstract

A dual voltage chip is fabricated with no intermediate-doped (LDD or MDD) area in the high-voltage transistors by adjusting the gate sidewall spacer thickness and the source/drain implant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.