Heat dissipation apparatus and method
US6157538A · kind A · utility
48Cited by
26References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 1998 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Dec 7, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system includes a housing, a support structure (e.g., a circuit board), and an electronic device mounted on the support structure. A heat dissipation apparatus is thermally coupled to the electronic device and the housing to direct heat from the electronic device into the housing. The heat dissipation apparatus may include layers of thermally conductive members coupled between the electronic device and the housing. In addition, the heat dissipation apparatus may be thermally coupled to the support structure to direct heat from the electronic device to the support structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.