Cooling apparatus for electronic devices
US6157539A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1999 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Aug 13, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling system for dissipating heat from a heat source is disclosed. The cooling system comprises a heat sink associated with a divider member. The heat sink includes a heat conductive base portion having a surface adapted to contact the heat source. The base portion has a peripheral wall member extending from the heat conductive base portion wherein the peripheral wall member defines a chamber therewithin and a heat sink device exterior located on the opposite side of the peripheral wall member from the chamber. A plurality of openings extend through the peripheral wall member between the heat sink device exterior and the chamber. An intake airflow path extends from the heat sink device exterior through a first portion of the plurality of openings to the chamber. An exhaust airflow path extends from the chamber through a second portion of the plurality of openings to the heat sink device exterior. A divider member is positioned adjacent the exterior of the heat sink device and separates the intake and exhaust airflow paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.