Thin planar heat spreader
US6158502A · kind A · utility
95Cited by
20References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 18, 1997 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Dec 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat spreading apparatus includes a body with an interior surface defining a void. The interior surface includes randomly configured high aspect ratio micro surface capillaries. Preferably, the micro surface capillaries are intergranular and intragranular capillaries that are less than 200 microns and have an aspect ratio of at least 1:1. All horizontal and vertical surfaces of the interior surface include the high aspect ratio micro surface capillaries. The high aspect ratio micro surface capillaries promote fluid transport and heat transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.