Slurry comprising a ligand or chelating agent for polishing a surface
US6159076A · kind A · utility
99Cited by
25References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 1998 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | May 28, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A novel slurry for polishing and a method of polishing using a slurry is disclosed. The slurry may include a colloidal silica abrasive in an aqueous solution. The slurry further includes a chelating agent that is believed to remove adsorbed ions from the surface of the layer being polished. The method may be used to polish a surface comprising, for example nickel and the chelating agent may be, for example, ammonium oxalate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.