Array type multi-chip device and fabrication method therefor
US6159768A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 19, 1999 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | May 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/40
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An array type multi-chip device and a fabrication method therefor form a plurality of devices of the same kind or different kinds into a single chip. The array type multi-chip device includes: an array type sintered body in which a plurality of unit devices are arranged such that internal electrodes of each of the unit devices are exposed at opposite side surfaces of the array type sintered body; glass pastes formed at portions of the side surfaces of the array type sintered body between the internal electrodes of the adjacent unit devices; external electrodes of conductive paste formed to cover the internal electrodes at the surfaces of the sintered body between the adjacent glass pastes and overlapping the glass pastes; and nickel and solder platings formed on surfaces of the external electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.