Process to prepare an array of wires with submicron diameters
US6159831A · kind A · utility
14Cited by
3References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 5, 1998 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Oct 5, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/962
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method is disclosed for forming an array of submicron-sized wires in a host body. In the method, the vapor of a metal, such as bismuth, is caused to flow upward through a horizontal refractory plate having many through holes, 200 nanometers or less in diameter, until all foreign material is excluded from the holes and then the plate is cooled from the top side to progressively and simultaneously condense said vapor to form said wires in the holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.