Patent · US Expired

Halogen-free epoxy resin

US6160077A · kind A · utility

1Cited by

3References

19Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Heiner Bayer · Olching, DE
Walter Fischer · Reinach, CH
Wilhelm Hekele · Burg (Dithmarschen), DE
Ernst Wipfelder · Munich, DE

Key dates

Filing date	Nov 20, 1998
Grant date	Dec 12, 2000
Priority date	—
Expiry date	Nov 20, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Halogen-free epoxy resins that arise from the addition of an epoxy component to a phenol component with base catalysis are disclosed, whereby the molar mass can be adjusted by means of the molar ratios of the initial materials. The resulting resins can be used in the field of electronics, both as molding compounds and as circuit board materials and adhesives.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.