Double-sided programmable interconnect structure
US6160276A · kind A · utility
16Cited by
47References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 25, 1999 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Jun 25, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0286
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An interconnect structure is centered around a substrate having opposite first and second surfaces. Component contacts allocated to cells in the substrate, are provided over both substrate surfaces. Conductive leads extend over each surface in two different directions. The conductive leads are selectively connected to the component contacts. The interconnect structure includes a capability for programmability electrically connecting, or disconnecting, the conductive leads in a desired manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.