Efficient solid-state high frequency power amplifier structure

US6160454A · kind A · utility

Assignee

• Motorola, Inc. · US

Inventors

• Kenneth V. Buer · Gilbert, US
• Dean Lawrence Cook · Mesa, US
• Richard S. Torkington · Mesa, US
• Edwin Stanfield · Queen Creek, US
• Phillip Denisuk · Chandler, US

Key dates

• Filing date: Oct 19, 1998
• Grant date: Dec 12, 2000
• Expiry date: Oct 19, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01P5/12
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

A power amplifier uses a plurality of solid-state amplifiers (FIGS. 2 and 3, 140) arranged in a parallel manner to form a power amplifier module (10). Each solid-state amplifier is adhered to a low thermal expansion insert (130). The insert is then coupled to a low cost aluminum substrate in order to carry the excess heat from each solid-state amplifier (140) to the aluminum housing. The power outputs from the solid-state amplifiers from each module are combined with the power outputs from other modules using electroformed waveguide combiners (FIG. 1, 30, 40).