IC module and IC card
US6160526A · kind A · utility
71Cited by
4References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1999 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Feb 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An IC module incorporated in an IC-card includes a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip. The antenna coil includes a conductive film which is patterned on a surface of the substrate, thereby facilitating fabrication of the IC module while realizing a thickness reduction of the IC module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.