Transient voltage protection device with ceramic substrate
US6160695A · kind A · utility
37Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1999 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Aug 10, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24992
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for fabricating transient voltage protection devices is described wherein a gap between a ground conductor and another conductor is formed using a diamond dicing saw. Substrate material selection and includes specific ceramic materials designed to optimize performance and manufacturability. An overlay layer can be provided to minimize burring of the conductors during formation of the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.