Device to encapsulate a substrate containing sensitive electronic components and a pressure sensor pack
US6161430A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 1998 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Oct 16, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60C23/0493
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A device for encapsulating a monitoring device for a pneumatic tire with an encapsulation material includes an encapsulation body having an encapsulation chamber. The monitoring device has at least a pressure sensor and an antenna. A damming element is carried by the encapsulation body in an adjustable manner such that the damming element contacts the pressure sensor of the monitoring device when the monitoring device is disposed within the encapsulation chamber. The damming element prevents the pressure sensor from being clogged with the encapsulating material when the monitoring device is encapsulated. The antenna of the monitoring device is held in a channel formed in the body when the monitoring device is disposed within the encapsulation chamber. The connection between the antenna and the body holds the monitoring device in a floating disposition in the encapsulation chamber. The damming element is in the form of a tube that also helps carry the monitoring device in the floating disposition. A breathing tube abuts the pressure sensor and extends through at least a portion of the damming element to further prevent the encapsulation material from clogging the pressure sensor. A …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.