Ultrasonic transducer off-aperture connection
US6162178A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1998 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Jul 31, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An ultrasonic transducer assembly includes a transducer mounted in a housing, the transducer including a piezoelectric element and respective matching and backing layers formed on the opposite sides thereof, the transducer mounted in the housing encapsulated with a non-conductive potting material. A portion of the matching layer is removed, e.g., by etching, to expose a portion of an underlying electrode formed between the piezoelectric element and the matching layer. A portion of the non-conductive potting material between the etched portion of the matching layer and a signal wire disposed in the housing is also removed. The respective voided portions of the matching layer and non-conductive potting material are filled with an electrically conductive matching material to electrically couple the electrode, and, thus, the piezoelectric element, to the signal wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.