Direct imaging polymer fluid jet orifice

US6162589A · kind A · utility

Assignee

• Hewlett-Packard Company, L.P. · US

Inventors

• Chien-Hau Chen · Corvallis, US
• Donald E. Wenzel · Albany, US
• Qin Liu · Boston, US
• Naoto Kawamura
• Richard W. Seaver · Corvallis, US
• Carl Wu · Corvallis, US
• Colby Van Vooren · Corvallis, US
• Jeffery Hess · Corvallis, US
• Colin C. Davis · Corvallis, US

Key dates

• Filing date: Mar 2, 1998
• Grant date: Dec 19, 2000
• Expiry date: Mar 2, 2018

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B41J2002/14475
• WIPO field: Textile and paper machines
• WIPO sector: Mechanical engineering

Abstract

A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.