Thermally conductive thermoplastic
US6162849A · kind A · utility
71Cited by
17References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 1999 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Jan 11, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/385
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to a thermally conductive moldable polymer blend comprising a thermoplastic polymer having a tensile at yield of at least 10,000 psi; at least 60% by weight of a mixture of boron nitride powders having an average particle size of at least 50 microns; and a coupling agent. The composition displays a thermal conductivity of at least about 15 W/m.degree. K and it is capable of being molded using high speed molding techniques such as injection molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.