Pressure-sensitive adhesive which can be applied while hot
US6162868A · kind A · utility
8Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1998 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Sep 24, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/24
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a pressure-sensitive adhesive comprising: PA1 a mixture of a block copolymer (A) comprising polystyrene blocks and polybutadiene or polyisoprene blocks which are optionally hydrogenated and of a copolymer (B) of ethylene and of an alkyl (meth)acrylate, PA1 at least one tackifying resin and optionally a plasticizer, PA1 this adhesive being deposited while hot on a substrate. These products are useful for self-adhesive labels and tapes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.