Insulating foil circuit board with rigid and flexible sections
US6162996A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1995 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Nov 21, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1184
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The multilayer foil circuit board according to the invention has rigid (s) and flexible (f) areas and in the rigid areas has more foil layers than in the flexible areas. The foil circuit board according to the invention is produced so that in the intended flexible areas (f) at least on one side at least the outermost foil layer (1.2) is removed by etching. By a corresponding etching mask design, it is possible to allow the flexible areas (f) to pass continuously into the rigid areas (s) in that the removal of the layers in the marginal areas (u) is less than in the center (z) of the flexible area (f), so that there are no marginal areas which have a tendency to break. The etching of the flexible areas can be performed in the same method stage as the etching of the plated through holes through the corresponding foil layer (1.2) or in a separate etching stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.