Method and apparatus for laser cutting materials
US6163010A · kind A · utility
42Cited by
11References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 24, 1998 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Apr 24, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/52
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser cutting of workpieces according to prior art results in heat affected zones (HAZ) of signiftcant thickness at the cut surface, which show seriously disturbed texture and/or microcracks. The HAZ is diminished by using a laser system with high beam quality and high brightness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.