Heat dissipation enhancing device
US6163453A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1999 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Sep 23, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fan duct induces an air flow generated by a fan of a lower supply of a computer to flow simultaneously through at least two heat-generating components of the computer. The fan dut is formed by plastic injection molding to have a cuboidal configuration, defining a first opening in alignment with the fan, a second opening proximate a first heat-generating component, and a third opening proximate a second heat-generating component when the fan duct is mounted in the computer at a predetermined position. When the fan is operated in a direction to draw air from the computer, an air flow is generated to simultaneously flow through the two heat-generating components and into the fan duct via the second and third openings. The heated air is then expelled out of the fan duct via the first opening to reach an exterior of the computer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.