Multiple size wafer vacuum chuck
US6164633A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 1999 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | May 18, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/90
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A vacuum holding chuck is presented. The vacuum holding chuck of the present invention is particularly well suited for holding semiconductor wafers of multiple diameters during various testing and manufacturing operations. In an exemplary embodiment, the vacuum chuck comprises a body having a first surface and an opposing second surface, wherein the first surface includes first and second recessed circular platforms to receive wafers having first and second diameters, respectively. The second surface includes at least one recessed circular platform to receive a wafer having a third diameter. Each circular platform is defined at least in part by an annular shoulder and each circular platform further includes a vacuum trough which is connected to a vacuum source which when activated, evacuates the air from the vacuum trough and securely holds a wafer in place within the circular platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.