Socket for integrated circuit chip
US6164980A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 21, 1998 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | May 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A three point alignment feature facilitates alignment of an integrated circuit chip relative to a socket that is mounted on a printed circuit board 14. The socket includes four walls that define a rectangle in which the integrated circuit chip is mounted. A first contact point 28 extends inward from a first one 22 of the walls. Second and third contact points 30, 32 extend inward from a second one 20 of the walls, which adjoins the first wall. A first force is applied against the integrated circuit chip from a third one 18 of the walls, which is parallel with the first wall. Second and third forces are applied against the integrated circuit chip from a fourth one 16 of the walls, which is parallel with the second wall. Hence, the integrated circuit chip is aligned in a corner defined by the first and second walls, and is oriented by the three contact points. Spring members 34, 36, 38, 40 may be employed to provide the first, second and third forces. Another alignment feature is employed to facilitate alignment of the socket with respect to the printed circuit board. Further, captive hardware fasteners may be employed to attache the socket to the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.