Double side grinding apparatus and double side polishing apparatus
US6165054A · kind A · utility
7Cited by
7References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 18, 1999 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Feb 18, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B7/17
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A double side grinding apparatus and a double side polishing apparatus, with a narrow tolerance range, reduces pitching errors, and ensures a sufficient level of rigidity against the force of reaction to machining, while enhancing positioning accuracy. The double side grinding apparatus or a double side polishing apparatus includes a plurality of guideways for supporting and shifting main spindles, and these plural guideways on end define a geometric center matched with the center of gravity of the main spindles. The number of the guideways is preferably three in order not to obstruct the mounting and removal of a workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.