Cyanide-free electroplating bath for the deposition of gold and gold alloys
US6165342A · kind A · utility
8Cited by
4References
12Claims
0Family size
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Key dates
| Filing date | Jun 2, 1998 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Jun 2, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/48
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Cyanide-free electroplating baths for deposition of gold and gold alloy coatings, using sulphurous gold complexes that are stable for a relatively long time, can be used with current density over 1 A/dm.sup.2 and are practically odor-free, are obtained when the sulphurous compounds used are mercaptosulfonic acids, dye sulfide sulfonic acids or salts thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.