Photosetting conductive paste
US6165386A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1999 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Sep 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4664
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
There is provided a photosetting conductive paste that has a surface resistance of no greater than 200 m.OMEGA./sq. upon curing by light irradiation. The photosetting conductive paste comprises conductive powder and a photosetting resin composition in specific amounts. The conductive powder contains dendritic conductive powder and scaly conductive powder at 80% or greater of the total conductive powder, the dendritic conductive powder having a mean particle size of 0.05-1.0 .mu.m, a specific surface area of 0.5-5.0 m.sup.2 /g, and the scaly conductive powder having a mean particle size of 1.0-10.0 .mu.m and a specific surface area of 0.5-5.0 m.sup.2 /g, wherein the weight ratio of the dendritic conductive powder and scaly conductive powder is 6/40-95/5. There is also provided a method of forming an antenna for a radio frequency identification medium that comprises printing the conductive paste on a substrate in an antenna-shaped pattern and curing it.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.