Replacing semiconductor chips in a full-width chip array
US6165813A · kind A · utility
13Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1995 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Apr 3, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. To remove a defective chip from the array, the substrate is urged evenly against a work surface defining a convex bow. Alternately, back-cuts are provided along abutting edges of the chips, and the silicon around these back-cuts can be sawed away to space defective chips from neighboring good chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.