Polyamide resin composition
US6166171A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1999 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Mar 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31732
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide resin composition comprising 100 parts by weight of a polyamide resin and 0.005 to 1.0 part by weight of at least one compound selected from the group consisting of a metal salt of a fatty acid, a diamide compound and a diester compound. The polyamide resin is obtained by solid phase-polymerizing a polyamide resin prepared by melt-polymerizing a diamine component containing 70 mol % or more of metaxylylenediamine and a dicarboxylic acid component containing 70 mol % or more of adipic acid, and preferably has a relative viscosity of 2.3 to 4.2 when measured at 25.degree. C. using a solution of 1 g polyamide resin in 100 ml of 96% sulfuric acid. By adding at least one compound selected from the group consisting of the specific metal salt of fatty acid, the diamide compound and the diester compound to a solid phase-polymerized polyamide resin, shaped articles such as films, sheets and hollow containers made of the solid phase-polymerized polyamide are improved in the resistance to whitening during storage tinder a high humid condition, upon contacting with water or boiling water, or upon heating to a glass transition temperature or higher.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.