PC card housing with insulative cover and ground feature
US6166324A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 1998 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Aug 6, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S174/34
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A card housing for printed circuit boards, wherein the card housing is provided with stamped covers having grounding members extending unitarily therefrom, wherein at least one grounding member is bent so that an outward surface of the grounding member is contiguous with an outward face of the cover. The cover having the bent grounding member is stamped from a metallic sheet having an insulative frame on one side that forms the outward face and surface. An insulative frame overlays a peripheral edge of each cover so that the two covers may be sealed to encase a printed circuit board inserted therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.