Integrated circuit having embedded memory with electromagnetic shield
US6166403A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1997 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Nov 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit including a substrate having a memory area and a non-memory area. An embedded memory is fabricated on the substrate within the memory area. First and second semiconductor cells are fabricated on the substrate within the non-memory area. An electromagnetic shield covers substantially memory area. A routing layer is fabricated over the memory and non-memory areas and over the electromagnetic shield. A signal wire is electrically coupled between the first and second semiconductor cells and has a conductive segment which is routed within the routing layer and extends over the memory area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.