Substrate for use in wafer attracting apparatus and manufacturing method thereof
US6166432A · kind A · utility
8Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 1998 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Mar 2, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer attracting apparatus includes a substrate made of a ceramic material and adapted to attract and hold a wafer onto an attracting surface thereof, wherein the attracting surface is constituted by a ductile worked surface, the ductile worked surface has concave portions, a diameter of each of the concave portions is 0.1 .mu.m or less, and when the wafer is attracted onto the attracting surface of the substrate and released therefrom, the number of particles attaching to that wafer is 9.3 or less per 1 cm.sup.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.