Resistance wiring board and method for manufacturing the same
US6166620A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1999 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Apr 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/107
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A resistance wiring board having a cavity disposed on an insulated substrate, a resistance disposed in the cavity, a protective film disposed on a top face of the resistance, and electrodes electrically connected at near both ends of the resistance, wherein surfaces of the electrodes and a surface of the protective film are the same level as or lower than a surface of the wiring board. A method for manufacturing a resistance wiring board comprising the steps of forming a green sheet, forming an electrode pattern on the green sheet, forming a dented pattern on the green sheet, firing the green sheet, forming a resistance by filling a resistance material in the dent of the green sheet, and forming a protective film on a top face of the resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.