Semiconductor integrated circuit card assembly
US6166911A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Nov 20, 1997 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Nov 20, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a semiconductor assembly, comprising a circuit board (1) including a conductor circuit (4), the conductor circuit including connecting pads, a semiconductor chip (2) provided with connecting terminals provided on a first surface thereof, and mounted on the circuit board, a casing (5) covering the circuit board, wherein the connecting pads of the conductor circuit and the connecting terminals of the semiconductor chip are disposed in mutually opposing relationship, and are connected with each other by an electroconductive bonding agent, a neutral plane of the semiconductor chip substantially coinciding with an overall neutral plane of the semiconductor assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.