Thin, planar heat spreader
US6167948A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 18, 1996 |
| Grant date | Jan 2, 2001 |
| Priority date | — |
| Expiry date | Nov 18, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat spreading apparatus includes a first planar body for attachment to a heat generating surface which results in a hot region and a cool region on the first planar body. A second planar body connected to the first planar body is used to define a void between the first planar body and the second planar body. The void includes a planar capillary path and a non-capillary region. A fluid positioned within the void distributes heat by vaporizing the fluid from the planar capillary path in the hot region, condensing the fluid in the non-capillary region in the cool region, and moving from the non-capillary region to the planar capillary path in the hot region through capillarity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.