Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
US6168502A · kind A · utility
12Cited by
32References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1998 |
| Grant date | Jan 2, 2001 |
| Priority date | — |
| Expiry date | Dec 14, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/91
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method and apparatus for conditioning a polishing pad in which slurry is directed under pressure at the polishing pad. Additionally, energy (i.e., ultrasonic energy) may be added to the slurry as it is directed towards the polishing pad, wherein embedded material in the polishing pad is removed or dislodged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.