Patent · US Expired

Method and device for stacking substrates which are to be joined by bonding

US6168678A · kind A · utility

9Cited by

8References

8Claims

0Family size

Assignee

Mannesmann Kienzle GmbH · DE

Inventors

Horst Plankenhorn · Villingen-Schwenningen, DE
Thomas Lindner · Polling, DE

Key dates

Filing date	Apr 8, 1994
Grant date	Jan 2, 2001
Priority date	—
Expiry date	Apr 8, 2014

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1744
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method and an apparatus are proposed in order to bond multilayered substrate packages over a large surface at uniform heating in the course of one single work step, wherein the structured substrates are to begin with aligned to one another with high precision to correspond to the structuring in a working area separate from the heating apparatus.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.