Copper foil and laminate containing a hydrogen inhibitor
US6168703A · kind A · utility
3Cited by
13References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1999 |
| Grant date | Jan 2, 2001 |
| Priority date | — |
| Expiry date | Mar 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.