System for adhering parts
US6168963A · kind A · utility
7Cited by
14References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1999 |
| Grant date | Jan 2, 2001 |
| Priority date | — |
| Expiry date | Jun 21, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/028
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A system for adhering a plurality of parts to a support film is provided. The parts are positioned between a support base with a heater and a cover membrane. The cover membrane is located beneath a sealed chamber. The chamber has an inlet through which gas is input. A downward force caused by gas pressure in the chamber causes the cover membrane to contact the parts and presses the plurality of parts against the film. A heating device heats the film to cause the parts to adhere to the film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.