Thermal conductive silicone rubber compositions and method of making
US6169142A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1999 |
| Grant date | Jan 2, 2001 |
| Priority date | — |
| Expiry date | Jun 17, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/2227
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Silicone rubber parts having a high thermal conductivity and low hardness are obtained by molding and curing a composition comprising (A) 100 parts by weight of an alkenyl-bearing organopolysiloxane having a viscosity of up to about 500,000 centistokes at 25.degree. C., (B) 300-1,200 parts by weight of aluminum oxide powder, (C) 0.05-10 parts by weight of an alkoxysilane of the formula: R.sup.1.sub.a Si(OR.sup.2).sub.(4-a) wherein R.sup.1 is a monovalent C.sub.6-20 hydrocarbon group, R.sup.2 is a C.sub.1-6 alkyl group, and a=1, 2 or 3, (D) a platinum group metal catalyst, and (E) an organohydrogenpolysiloxane containing at least two SiH groups in a molecule. The composition is formulated so as to suppress the viscosity increase of a liquid silicone rubber composition due to heavy loading of aluminum oxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.