Metered force single point heatsink attach mechanism
US6169659A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 4, 2000 |
| Grant date | Jan 2, 2001 |
| Priority date | — |
| Expiry date | Feb 4, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is drawn to a system and a method for attaching and tightening a mechanism onto an IC package such that a load-balanced thermal contact is formed securely between the mechanism and the IC package without risking damages to the IC package. The mechanism is then used to support a heat sink that utilizes the thermal contact formed for dissipating heat away from the IC package. Specifically, the mechanism is modified in stages. During the tightening stage, the mechanism is modified from a first configuration into a second configuration in order to trigger the process of tightening the mechanism securely onto the IC package. More specifically, in its first configuration during the attaching stage, the mechanism includes a spring compressed within a first spacing formed by a bearing plate and a compression screw. Then, the mechanism is modified into the second configuration by the removal of the compression screw, wherein the same spring is compressed at a second spacing formed by the bearing plate and a terminating plate, and wherein the second spacing is longer than the first space as to allow the spring to lengthen to a desired length. As the spring lengthens to …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.