Vacuum drying of semiconductor fragments
US6170171A · kind A · utility
17Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Dec 8, 2018 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF26B5/04
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method and apparatus for drying semiconductor fragment material, has at least one vacuum-tight chamber with at least one receiving means for semiconductor fragment material, and there is a means for maintaining a vacuum in the apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.