Apparatus and method for servicing a wafer platform
US6170496A · kind A · utility
15Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Aug 26, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for servicing a wafer chuck such as an electrostatic chuck that is equipped with vent holes for cooling the backside of a wafer positioned on the chuck and for clearing the vent holes is provided. The novel apparatus can be used either in replacing a gas supply conduit to the electrostatic chuck without having to break vacuum in the process chamber, or can be used in clearing the vent holes when servicing an electrostatic chuck. The apparatus consists of a three-way control valve and a high pressure gas supply line of a suitable inert gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.