Optical module encapsulated with resin and manufacturing method therefor
US6170996A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1999 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Jun 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module including a lead frame having a plurality of leads, a substrate mounted on the lead frame and having a plurality of conductive patterns, an optical element mounted on the substrate for making conversion between light and electricity, a sleeve placed on the substrate and having a front end adjacent to the optical element, and a first resin for encapsulating the optical element. The first resin has transparency to the light related to the optical element. The first resin is formed with a convex portion closing the front end of the sleeve. The conductive patterns of the substrate are connected through wires to the leads of the lead frame, respectively. The optical module further includes a molded second resin for enclosing all of the substrate, the optical element, the sleeve, the first resin, the wires, and the lead frame except a part of the sleeve and a part of each of the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.