Method and device for receiving, orientating and assembling of components
US6171049A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Jul 23, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Workpieces such as chips are removed from a receiving plane by a transfer unit, which carries them to a delivery plane. The workpieces are transported in two segments during two phases, each workpiece being deposited between the phases on an intermediate station arranged in the region of the feed path. The transfer unit has two working heads, which simultaneously transport one workpiece from the receiving plane to the intermediate station, and another workpiece from the intermediate station to the delivery plane. The workpiece can be pivoted or rotated at the intermediate station so that its lower surface can be grasped by the depositing head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.