Platen sensing and alignment apparatus
US6171092A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Oct 2, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2945/76943
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for detecting whether platens in a mold clamp remain parallel throughout an entire molding process. The apparatus includes a frame, a first platen having a surface orthogonal to a predetermined axis, a second platen having a surface opposing the first platen, the second platen being reciprocatable along the predetermined axis, actuating cylinders for reciprocating the second platen along the predetermined axis, and positions transducers for electromagnetically detecting the positions of a plurality of points on the surface of the second platen. The method includes the steps of emitting first and second electromagnetic interrogation pulses from a controller, transmitting the first pulse to a first transducer rod fixed relative to the first platen, and transmitting the second pulse to a second transducer rod fixed relative to the first platen and parallel to the first transducer rod, generating a first return signal when the first pulse reaches a magnet disposed adjacent to the first transducer rod and fixed relative to one end of the second platen, and generating a second return signal when the second pulse reaches a magnet disposed adjacent to the second tra…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.