Electrochemical-control of abrasive polishing and machining rates
US6171467A · kind A · utility
101Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Nov 24, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32125
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method is disclosed; both of which use electrochemistry to selectively grow and remove hard oxide coatings on metals, and capacitive double layers on non-metals and semiconductors in order to predict and control the rate of surface abrasion during planarization of the surface of such materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.