Infiltrated nanoporous materials and methods of producing same
US6171687A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1999 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Oct 18, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/254
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with the present invention, a low dielectric constant structural layer is produced having increased mechanical strength and having a plurality of voids that comprises a substrate layer; a low dielectric structural layer juxtaposing the substrate layer; and an infiltrating layer comprising an infiltrating material having a volatile component and a reinforcing component juxtaposing the structural layer and coating at least some of the plurality of voids. Also, methods are provided in which the mechanical strength of a structural layer having a plurality of voids is increased by a) depositing the structural layer on a substrate layer; b) providing an infiltrating material having a volatile component and a reinforcing component; c) introducing the infiltrating material into at least some of the plurality of voids; and d) treating the infiltrating material such that the structural strength is increased by a substantial amount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.